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 Chip Dielectric Filters
TDF
Series
TDF series for Mobile & Cordless Phone
SELECTION GUIDE FOR STANDARD DEVICES
* The Part Numbers shown in the table below are standard devices, which are readily available. TOKO will design and manufacture modified and custom devices with specific characteristics to meet your requirements. If you do not find the device for your application in this catalog, please contact our sales or representative office. * RoHS compliant
* *
TOKO Part Number
Center Insertion V.S.W.R. Bandwidth Frequency Loss in BW (MHz) (MHz) (dB) Max. Max. 836.5 881.5 904.0 915.0 915.0 915.0 915.0 930.5 942.5 1090.0 1747.5 1842.5 1842.5 1880.0 1880.0 1900.0 1900.0 1907.0 1907.0 1907.0 1907.0 1907.0 1920.0 1950.0 1960.0 1960.0 1960.0 1960.0 2140.0 Fo 12.5 Fo 12.5 Fo 1.0 Fo 13.0 Fo 13.0 Fo 13.0 Fo 13.0 Fo 1.5 Fo 17.5 Fo 7.0 Fo 37.5 Fo 37.5 Fo 37.5 Fo 30.0 Fo 30.0 Fo 20.0 Fo 20.0 Fo 12.5 Fo 12.5 Fo 13.5 Fo 12.5 Fo 12.0 Fo 70.0 Fo 30.0 Fo 30.0 Fo 30.0 Fo 30.0 Fo 30.0 Fo 30.0 2.70 2.70 3.00 3.00 3.50 4.50 3.20 3.50 4.00 5.50 3.00 4.00 3.00 3.00 4.00 1.10 1.70 0.75 0.65 1.00 1.00 1.60 2.00 3.30 4.00 3.00 3.30 4.00 3.30 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.50 2.00 2.00 2.00 2.00 2.00 1.80 1.60 1.50 1.50 1.60 1.50 1.50 2.00 2.00 2.00 2.00 2.00 2.00 2.00
Selectivity (dB) Min. (MHz) 6 (Fo 32.5) 6 (Fo 32.5) 40 (Fo 140) 12 (Fo 50) 18 (Fo 50) 32, 25 (Fo - 77.5, + 77.5) 25, 17 (Fo - 77.5, + 77.5) 40 (Fo - 90) 20 (Fo - 27.5) 35, 33 (Fo 80) 8, 25 (Fo 80, 160) 32 (Fo - 57.5) 8, 25 (Fo 80, 160) 34, 39 (Fo 190, 240) 12 (Fo + 50) 20 (Fo - 480, + 210) 12, 20 (Fo - 140, + 241) 45, 15 (Fo - 486, - 237) 35, 13 (Fo - 486, - 237) 40 (Fo - 248) 40, 20 (Fo - 486, - 237) 35, 40 (Fo - 486, - 237) 25, 25 (Fo - 350, + 780) 25 (Fo - 230, + 160) 32 (Fo - 50) 34, 39 (Fo 190, 240) 20 (1850~1910) 12 (Fo - 50) 25 (Fo 160)
Dimension (mm) W x L x T (Max.) 5.7 x 9.9 x 2.25 5.7 x 9.4 x 2.25 3.2 x 8.5 x 1.8 4.5 x 7.7 x 2.25 6.5 x 7.9 x 2.25 4.5 x 8.3 x 2.0 3.2 x 8.4 x 1.8 4.5 x 7.5 x 2.0 11.5 x 8.4 x 5.5 4.5 x 7.6 x 2.25 6.5 x 4.75 x 2.0 14.1 x 6.6 x 5.5 6.5 x 4.5 x 2.0 6.5 x 4.4 x 2.0 9.0 x 6.8 x 2.8 6.5 x 5.3 x 3.0 4.5 x 3.8 x 2.8 5.7 x 6.1 x 3.0 5.7 x 5.9 x 3.0 5.7 x 6.25 x 2.9 4.5 x 3.8 x 2.8 4.5 x 3.8 x 2.8 6.5 x 4.1 x 2.0 6.5 x 4.2 x 2.0 14.1 x 6.1 x 5.5 6.5 x 4.2 x 2.0 6.5 x 6.0 x 2.8 9.0 x 6.4 x 2.8 6.5 x 5.85 x 2.0
Application US Cellular US Cellular 900M-CT 900M-CT 900M-CT 900M-CT 900M-CT PAGER EGSM CATV PCN PCN PCN PCS PCS PHS PHS PHS PHS PHS PHS PHS PCS W-CDMA PCS PCS PCS PCS W-CDMA
Pcs/Reel 1500 1500 2000 1500 1500 1500 1500 1500 500 1500 1500 500 1500 2000 1500 1500 2000 2000 2000 2000 2000 2000 2000 2000 500 2000 1500 1500 1500
TDF2A-836E-10A TDF2A-881E-10A TDFS8A-904A-11A TDFM2A-915E-10A TDFM2B-915E-10A TDFS1B-915E-10A TDFS8A-915E-10A TDFM1A-930A-12A TDFH5C-942G-11A-02 TDFM2A-1090C-11A TDFM1B-1747O-11A TDFH5D-1842O-10A-01 TDFM1B-1842O-11A TDFM1B-1880L-11A TDFM3C-1880L-11A TDF3B-1900H-11A TDFM3A-1900H-10A TDF3A-1907E-18A TDF3A-1907E-19A TDF3A-1907E-21A-01 TDFM3A-1907E-10A TDFM3A-1907E-11A TDFM1B-1920V-10A TDFM1B-1950L-10A-01 TDFH5D-1960L-11A-01 TDFM1B-1960L-11A TDFM3B-1960L-13A TDFM3C-1960L-10A TDFM1B-2140L-10A
Chip Dielectric Filters
TDF
Series
TDFM1B-1960L-11A
Typical Characteristics
TDFM1B-1960L-11A
0 10 0 5
5.7 5.5 1.2
GND GND GND
20
Attenuation
10
Attenuation (dB)
40 50
20 25
Return loss
60 70 30 35 40 45 50
B1960-11 TOKO
4.2
OUT
IN
2.0
3.2
0.8
6.5
2.0 Max.
GND
GND
80 90 100
1.2 3.3
1.2
Center Frequency :1,960MHz
Span :600MHz
(Unit: mm)
TDFS8A-915E-10A
Typical Characteristics
TDFS8A-915E-10A
0 10 0 5 10
2.4
Attenuation (dB)
GND
20
0.8
40 50 60 70
20
Attenuation
Return loss
25 30 35 40 45 50
0.6
OUT
GND
0.8
80 90 100
3.2
1.8Max. (Unit: mm)
Center Frequency :915MHz
Span :300MHz
TDFM1B-2140L-10A
Typical Characteristics
TDFM1B-2140L-10A
Attenuation(dB)
6.5
GND GND
1.0
GND
Return loss Attenuation
B2140-10 TOKO
OUT
6.5
2.0Max.
GND
2.3 4.3
GND
IN
4.65
5.8
Center Frequency : 2,140MHz (Unit: mm)
Span : 1,000MHz
Return Loss(dB)
Return Loss (dB)
09E
8.4
IN
0.6
30
15
3.5
Return Loss (dB)
30
15
1.2
;;; ; ;;;;; ; ;;; ;;;;; ;; ;;; ; ;; ;; ;; ;;
Series
PART NUMBERING SYSTEM /
Chip Dielectric Filters
TDF
;; ;;; ;;; ;; ; ;;
TDFS Type TDFM Type TDF Type TDFH Type
T2 T3 T1
;;; ; ; ;;
TDFM 3 A 1907 E 10 A P
Taping / Solder Plate Less / Specification Code / Bandwidth Code / Center Frequency / #Poles / Profile Code / TOKO's Type Name /
DIMENSIONS /
2 Poles
3.2
L
4.5
T4
L
5.7
L
5.7
L
T3
T1
T2
3 Poles
4.5
L
6.5
L
8.5
T4
L
8.5
L
T3
T1
T2
4 Poles
6.5
L
9.0
L
11
T4
.5
11
.5
L
L
unit:mm
T1
T2
T3
T4
2.25 Max. 2.0 Max. 1.8 Max.
2.8 Max. 2.25 Max. 2.0 Max.
3.0 Max. 2.25 Max. 2.0 Max.
5.5 Max. 4.0 Max.
*The length, L, is different depending on the part number. Refer to the separate table.
*For the details of shapes regarding individual part numbers, contact us separately
Temperature profile (land seface temperature) ( )
for leaded process
230 210 190 180 150 260 240 220 180 150
for lead free process
*1 Pre-heat conditions *1 150 160 60s. Max. Reflow conditions *2 160 Min. 45s. Max. *3 200 Min. 30s. Max. *4 2305 5s. Max.
*4 *3 *2 *1 150 160 *2 160 *3 200 *4 2305 60 45 30 5
*1 Pre-heat conditions *1 150 180 120s. Max. Reflow conditions *2 180 Min. 150s. Max. *3 230 Min. 40s. Max. *4 2555 5s. Max.
*4 *3 *2 *1 150 180 *2 180 *3 230 *4 2555 120 150 40 5
1. Reflow solder conditions *Solderability When flux-mounted terminals are immersed in solder at following conditions, at least 95% of the surface should be covered by solder. Conditins leaded process : 2305C for 30.5 seconds lead free process : 2605C for 30.5 seconds *Solder heat resistance No abnomalities under solder conditions of leaded process : 2305C for 5 seconds lead free process : 2605C for 5 seconds 2. Rinsing After Soldering, you should rinsing away the excess flux. Any commercially available rinsing agent may be used. 3. Other Precautions Perform soldering at as low a temperature as possible and for as short a time as possible. Make sure that the silver electrode of resonators is not covered by solder. Avoid applying external forces to terminals such as by bending or cutting them. 4. Iron Soldering Perform iron soldering with iron at following conditions. Conditins leaded process : 3505C for 5s. Max. lead free process : 3905C for 5s. Max.


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